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Innovative Single-Wafer Photoresist and Residue Removal Technology for MEMS Markets

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™-an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets.

“Increasing wafer processing challenges associated with the adoption of new materials, device architectures and packaging schemes requires a new, holistic view of wafer cleaning, where the chemistry, process and equipment are all critically important and must be addressed in combination,” stated Steven Dwyer, business director at Dynaloy. “We’re pleased to be working with EV Group on developing and commercializing CoatsClean technology to meet the needs of our customers for a more cost-effective, flexible approach to thick-film resist removal.”

Click Here to Read the Full Article.

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